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IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING
期刊信息导读
- IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING基本信息
- IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING中科院SCI期刊分区
- 历年IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING影响因子趋势图
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING基本信息
简称：IEEE T ELECTRON PACK
SCI类别：无
是否OA开放访问：No
出版地：UNITED STATES
出版周期：Quarterly
通讯方式：IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
官方网站：http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6104
投稿网址：http://mc.manuscriptcentral.com/tepm-ieee
平均录用比例:容易
PMC链接：http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1521-334X%5BISSN%5D
中科院SCI期刊分区：
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING影响因子
