IEEE Transactions on Components Packaging and Manufacturing Technology

期刊信息导读

1. IEEE Transactions on Components Packaging and Manufacturing Technology基本信息
• 2018-2019最新影响因子
• 2022年6月28日更新影响因子
• 研究方向
• 官方网站
• 年文章数
2. IEEE Transactions on Components Packaging and Manufacturing Technology中科院SCI期刊分区
3. 历年IEEE Transactions on Components Packaging and Manufacturing Technology影响因子趋势图
4. IEEE Transactions on Components Packaging and Manufacturing Technology期刊英文简介
5. IEEE Transactions on Components Packaging and Manufacturing Technology期刊中文简介

IEEE Transactions on Components Packaging and Manufacturing Technology基本信息

简称：IEEE T COMP PACK MAN

中文名称：IEEE元件封装和制造技术汇刊

研究方向：工程技术

2018-2019最新影响因子：1.86

2022年6月28日更新影响因子：1.922

SCI类别：SCI/SCIE

是否OA开放访问：No

出版地：UNITED STATES

创刊年份：2011

年文章数：224

涉及的研究方向：工程技术-工程：电子与电气

官方网站：https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=PER240-PRT

审稿速度：一般,3-6周

平均录用比例:容易

PMC链接：http://www.ncbi.nlm.nih.gov/nlmcatalog?term=2156-3950%5BISSN%5D

IEEE Transactions on Components Packaging and Manufacturing Technology期刊英文简介

IEEE Transactions on Components, Packaging, and Manufacturing covers the following content areas: modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.Membership in IEEE's technical societies provides access to top quality publications such as this one either as a member benefit or via discounted subscriptions. The electronic version of this journal is part of the CPMT Society membership, but all media types are also offered for purchase.

IEEE Transactions on Components Packaging and Manufacturing Technology期刊中文简介

IEEE关于组件、封装和制造的交易涵盖了以下内容领域：建模、设计、构建模块、技术基础设施和支持电子、光子和MEMS封装的分析，以及无源组件、电气触点和连接器、热管理和设备可靠性方面的新发展；以及电子零件和总成的制造，具有广泛的设计、工厂建模、装配方法、质量、产品鲁棒性和环境设计。IEEE技术协会的会员资格提供了访问顶级出版物的机会，如作为会员利益或通过折扣订阅。该杂志的电子版是CPMT协会会员的一部分，但也提供所有媒体类型的购买。

中科院SCI期刊分区：

IEEE Transactions on Components Packaging and Manufacturing Technology影响因子

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